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WHERE PHOTONICS MEETS AI

Breaking optical-interconnect limits with photonics × AI—moving data faster and greener.

Innovation

Join the Global Leaders Working with Us

Innovation

Reinventing Ultra Light-Speed Transmission

AI-powered PDK & ADK streamline next-gen photonics design, while Metalens applications enable precise light control. Short-range high-speed transmission ensures seamless data flow, fully compatible with CMOS processes.

 

By integrating AI, Metalens, and new optical architectures, Brillink builds light-speed pathways that connect intelligence and creativity, driving innovation and unlocking future possibilities.

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Short-Range High-Speed Transmission

Targeting data centers and AI accelerators, we develop novel optical modules using micro-LED light sources, featuring high frequency, low power consumption, and high integration to meet next-generation data exchange requirements.

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Metalens Innovative Applications

By integrating metallic metastructure lenses (Metalens), optical component size is greatly reduced and coupling efficiency improved. Co-packaged with light-emitting modules on a single wafer, this approach enhances overall system speed and spatial efficiency.

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CMOS-Compatible Wafer-Level Production

Core module design and processes are fully compatible with 12-inch CMOS wafer platforms. This enables seamless integration into mature semiconductor lines, offering scalable production, quality control, and cost competitiveness.

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New Transmission Architecture with Ultra-Sensitive PD

Deeply integrating our parent company’s ultra-sensitive photodetector (PD) technology, spanning shortwave to infrared, this approach combines high-speed micro-LED emission with highly sensitive detection, effectively overcoming short-range optical transmission bottlenecks.

Innovation

Reinventing Ultra-High-Speed Optical Interconnects

AI-driven PDKs and ADKs accelerate next-generation photonics design, while metasurface optics enable precise coupling and beam control. Our short-reach links deliver high bandwidth at ultra-low power and are fully CMOS-compatible.

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Short-Reach, High-Speed Optical Links

For data centers and AI accelerators, we build microLED-based optical modules that deliver ultra-high bandwidth density at ultra-low power—ready for next-generation interconnects.

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Innovative Metasurface Optics

Integrating metasurface optics shrinks the optical stack and boosts coupling efficiency. Wafer-level co-packaging with light-emitting modules enables higher link density and throughput while reducing footprint and alignment complexity.

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New Link Architecture with Ultra-Sensitive PDs

Powered by our parent company’s ultra-sensitive PDs, microLED/low-noise-receiver pairs remove short-reach bottlenecks, boosting bandwidth and cutting power from visible to IR

Customers

Key Customers & Partners

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Service and Solution

ADK/PDK Development :

Ultra-low-loss perfect vertical couplers; high-speed modulators, Ultra-high-sensitivity Ge-on-Si PD   

 

PIC Design Service :

200G-per-channel DR/FR; optical-sensing PIC

 

MicroLED Optical Interconnect Solution:

Short-reach, high-bandwidth, ultra-energy-efficient modules

Engagement Models

Co-development (JDP)  : 

Build together from concept to production

 

Contract Development : 

Commissioned projects delivered under NRE

 

Design-In (Spec-In) : 

Our solutions designed to your spec/BOM

Other Flexible Models : 

We adapt to your needs

End Customers/Applications

AOC 

CPO 

Optical Sensor

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Reach Out Anytime

Contact

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News

Breakthroughs in Next-Gen Optical Fiber Technology

New fiber innovations deliver faster speeds and higher efficiency, driving the future of global communications.

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Empowering AI Data Centers with Advanced Fiber Solutions

Advanced optical fibers boost AI data centers with ultra-fast, low-latency, and energy-efficient connections.

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Revolutionizing On-Chip Integration with Optical Fiber Innovations

On-chip fiber integration enables compact, high-speed, and efficient interconnects for next-gen chips.

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