Innovation
Join the Global Leaders Working with Us
Short-Reach, High-Speed Optical Links
For data centers and AI accelerators, we build Micro LED / Micro VCSEL array-based optical modules that deliver ultra-high bandwidth density at ultra-low power—ready for next-generation interconnects.
Innovative Metasurface Optics
Integrating metasurface optics shrinks the optical stack and boosts coupling efficiency. Wafer-level co-packaging with light-emitting modules enables higher link density and throughput while reducing footprint and alignment complexity.
New Link Architecture with Ultra-Sensitive PDs
Powered by our parent company’s ultra-sensitive PDs, low-noise-receiver pairs remove short-reach bottlenecks, and Micro LED / Micro VCSEL, boosting bandwidth and cutting power from visible to IR.
NEW
Service
Brillink’s Performance Breakthroughs
Multiplying data throughput within constrained footprints to unlock optimal space efficiency for next-generation high-density servers and switches.
Customers
Key Customers & Partners
Service and Solution
ADK/PDK Development :
Ultra-low-loss perfect vertical couplers; high-speed modulators, Ultra-high-sensitivity Ge-on-Si PD
PIC Design Service :
200G-per-channel DR/FR; optical-sensing PIC
Micro LED / Micro VCSEL Optical Interconnect Solution:
Short-reach, high-bandwidth, ultra-energy-efficient modules
Engagement Models
Co-development (JDP) :
Build together from concept to production
Contract Development :
Commissioned projects delivered under NRE
Design-In (Spec-In) :
Our solutions designed to your spec/BOM
Other Flexible Models :
We adapt to your needs
End Customers/Applications
AOC
CPO
Optical Sensor
News
Breakthroughs in Next-Gen Optical Fiber Technology
New fiber innovations deliver faster speeds and higher efficiency, driving the future of global communications.
Empowering AI Data Centers with Advanced Fiber Solutions
Advanced optical fibers boost AI data centers with ultra-fast, low-latency, and energy-efficient connections.
Revolutionizing On-Chip Integration with Optical Fiber Innovations
On-chip fiber integration enables compact, high-speed, and efficient interconnects for next-gen chips.
