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Service &
Supply Chain

Surpassing the reach limits of copper,

shrinking optical module footprints, and maximizing both bandwidth density and energy efficiency.

 

Brillink leverages a dual-core technology

approach—integrating Micro LED and Silicon Photonics—to conquer the distinct Scale-Up and Scale-Out interconnect bottlenecks of the AI era, defining the optical architecture for next-generation AI data centers.

 

We actively seek supply chain partners to expand our ecosystem and join us in accelerating the deployment of this transformative technology.

Scale-Out
Scale-Up

Surpassing the reach limits of copper, shrinking optical module footprints,

and maximizing both bandwidth density and energy efficiency.

 

Brillink leverages a dual-core technology approach—integrating Micro LED and

Silicon Photonics—to conquer the distinct Scale-Up and Scale-Out interconnect bottlenecks of the AI era,

defining the optical architecture for next-generation AI data centers.

 

We actively seek supply chain partners to expand our ecosystem and join us

in accelerating the deployment of this transformative technology.

Scale-Out

Scale-Up

Surpassing the reach limits of copper, shrinking optical module footprints,and maximizing both bandwidth density and energy efficiency.

 

Brillink leverages a dual-core technology approach—integrating Micro LED and Silicon Photonics—to conquer the distinct Scale-Up and Scale-Out interconnect bottlenecks of the AI era, defining the optical architecture for next-generation AI data centers.

 

We actively seek supply chain partners to expand our ecosystem and join us in accelerating the deployment of this transformative technology.

Total solution provider

Beyond Design:
A Total Solution Partner

Beyond Design: A Full-Spectrum Ecosystem While positioned as a fabless design house, Brillink leverages a tightly integrated supply chain ecosystem. We go beyond providing comprehensive optical design solutions by bridging clients directly with top-tier foundries (FABs) and validation partners, ensuring seamless system implementation and reliability. Our core strategic focus targets 1.6T Transceivers and 3.2T CPO (Co-Packaged Optics), accelerating the deployment of next-generation high-speed optical interconnects.

01

Brillink

SiPh System Architecture Architecture

02

Brillink

SiPh PIC Design & Simulation

03

Partner

Foundry Process

04

Brillink

PIC, Material & Equipment Verification

(> 200 Gbps)

05

Brillink

Optical Engine Design & Simulation

06

Partner

Module Testing & Verification

07

Brillink

Accelerating Photonic Innovation, Together

> 3.2T Transceiver & CPO

Micro LED transmission

CPO transmission

Scale-Up Solution : Micro LED

Direct CSP Alignment & Partnership Opportunities

Leveraging deep strategic alignment with top-tier CSPs, Brillink’s Micro LED short-reach solutions have secured critical specifications and are precisely tailored to end-user applications—ensuring a powerful advantage for market deployment. We warmly invite industry partners with complementary technologies to join us. Through vertical integration and technical synergy, let us co-define and drive the standards for the next generation of optical communication systems

Fiber

Connecter  

Equipment

Data Center Supplier

CMOS 

( Driver, TIA, GeSi-PD ) 

Micro LED Bonding to Chip

Micro LED    

Micro / Meta Optics 

ASIC 

OE Engine 

Micro LED Bonding to Chip

Verification

Go

OE to OE Connecting

Go

End User

CSP

Assembly

on CMOS

Go

Module Design

Go

Manufacture

Go

Scale - Out Solution : Photonic IC

One-Stop Platform for Long-Range Photonic IC Solutions

Brillink combines AI with advanced chip design to create robust PDK and ADK IPs for long-reach Photonic ICs, streamlining the design process for >200 Gbps / Lane performance. Through validated foundry (FAB) partnerships, we guarantee that our high-integration solutions meet critical requirements for reliability and mass production. We invite industry partners to join our ecosystem. By integrating our strengths, we can co-define the standards and accelerate the future of optical communication.

>200 Gbps / Lane

PIC Platform

Photonic IC ( PIC )

FAU / Connector

Laser ( > 100 mW )

FAB / Foundry

OSAT / Assembly

PIC

Test

Go

OEM

Go

Integration

&

Verification

Go

Module Design

Go

IP

( PDK + ADK )

Development

hi-tech-digital-interior-abstract-data-center-server-business-technology-blured-polygonal-

Contact

Join Brillink to Pioneer a New Cloud Era by Leveraging Our Market-Ready Micro LED and Standardized Photonic ICs.

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